transient thermal-mechanical simulation (COMSOL Inc)
90
Structured Review
COMSOL Inc
transient thermal-mechanical simulation
Transient Thermal Mechanical Simulation, supplied by COMSOL Inc, used in various techniques. Bioz Stars score: 90/100, based on 1 PubMed citations. ZERO BIAS - scores, article reviews, protocol conditions and more
https://www.bioz.com/product/transient+thermal-mechanical+simulation/transient+heat+transfer+analysis/10__1109_slash_tpel__2023__3293162-137-0-15
Average 90 stars, based on 1 article reviews
Transient Thermal Mechanical Simulation, supplied by COMSOL Inc, used in various techniques. Bioz Stars score: 90/100, based on 1 PubMed citations. ZERO BIAS - scores, article reviews, protocol conditions and more
https://www.bioz.com/product/transient+thermal-mechanical+simulation/transient+heat+transfer+analysis/10__1109_slash_tpel__2023__3293162-137-0-15
Average 90 stars, based on 1 article reviews
transient thermal-mechanical simulation - by Bioz Stars,
2026-10
90/100 stars
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other:Article Title: An Automated Field-Circuit Coupling Simulation Method Based on PSpice-MATLAB-COMSOL for SiC Power Module Design Article Snippet: Multiphysics simulation software is indispensable for silicon carbide (SiC) power module design.. Lacking interface between circuit simulation software and thermal-fluid-mechanical simulation software poses challenges for accurate design of the power modules.. In this article, an automated field-circuit coupling simulation method based on the self-developed COMSOL-PSpice interface software is proposed to achieve precise and fast multiphysics cosimulation of multichip SiC power modules. |